Embidio Nano

Ultra-Compact System-on-Module for Mass Production

embidio nano

Feature Highlights

  • Compact System-on-Module (SoM) design for mass production.

  • Advanced signal processing (Beamforming, NR, AEC) for precise voice capture.

  • Supports up to 8 MEMS microphones (I2S or PDM).

  • Integrated beamforming for focused audio capture.

  • Dual speaker connections (2x 4W Stereo).

  • Dedicated Development Kit available for optimization.

  • Extensive interface options (SPI, I2C, USB) for flexibility.

  • Firmware updatable via USB.

Ultra-Compact SoM

Integrates seamlessly into space-constrained products, ideal for mass production scalability.

Powerful XMOS Core

Delivers robust audio processing and reliable performance for demanding voice applications.

Rich Interfaces

Offers extensive connectivity (I2S, PDM, I2C, SPI) for maximum design flexibility and expansion.

Mass Production Ready

Optimized design and form factor specifically for efficient, large-scale manufacturing.

Target Applications

  • Smart Home Devices (Speakers, Hubs, Appliances)

  • Consumer Electronics with Voice Control

  • Industrial Control Panels and Interfaces

  • Medical Devices with Voice Interaction

  • Automotive Infotainment and Voice Assistants

  • Wearable Technology

  • Security and Access Control Systems

Technical Specifications

Highlights

  • Microphone Input
    Up to 8 MEMS (I2S or PDM)
  • Speaker Output
    2 x 4 W Stereo
  • Audio Interface (via DevKit/Integration)
    USB Audio Class 1.0 / 2.0
  • Control/Expansion
    SPI, I2C (via module pins)
  • OS Support (Audio via USB)
    Linux, Windows, MacOS
  • Firmware Update
    via USB (using DevKit or host)
  • Control
    I2C or USB (via DevKit or host)

Physical Data (Module Only)

  • Dimensions
    50 x 24 mm
  • Ambient operating temperature
    0°C to 70°C
  • Storage Temperature
    -55°C to 125°C
  • Power Supply
    Typically 3.3V/5V DC

Audio Processing Core

  • Input Channels
    Up to 8
  • Output Channels
    2 (Stereo)
  • Sampling Rates
    16 / 48 kHz
  • DSP Features
    Beamforming, Noise Reduction (NR), Acoustic Echo Cancellation (AEC), AGC, EQ, etc.

Interfaces

  • I2S
    8 channels for up to 8 MEMS microphones.
  • PDM
    8 channels for up to 8 MEMS microphones.
  • USB
    USB Audio Class 1.0 / 2.0 for host connection.
  • SPI
    For firmware updates and control.
  • I2C
    For control and expansion.
  • JTAG/DEBUG
    For debugging and development.

Signal Processing Details

  • Beamformer
    Focuses on the speaker.
  • Noise Reduction
    Suppresses stationary noise.
  • Acoustic Echo Cancellation (AEC)
    Prevents feedback.
  • Automatic Gain Control (AGC)
    Optimizes amplitude.
  • Equalizer (EQ)
    Fine-tunes sound.
  • Additional DSP
    Far End NR, Comfort Noise, DC Filter, Leveler, Acoustic Echo Suppression.

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